|
|
|
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|
Grade of Sintered AlN
|
S-1
|
S-HTC
|
|
|
Bulk
Density (min)
|
g/cmˆ3
|
3.28
|
3.28
|
|
|
Average
Grain Size
|
µm
|
10
|
10
|
|
|
Flexural
Strength,
(4-Pt MOR) @RT
|
Ksi
MPa
|
40
275
|
43
300
|
|
|
Characteristic
Strength
|
MPa
|
282
|
330
|
|
|
Weibull
Modulus (m)
|
|
20
|
10
|
|
|
Elastic
Modulus (E)
|
GPa
|
330
|
330
|
|
|
Poisson's
Ratio (v)
|
|
0.23
|
0.23
|
|
|
Hardness
(Knoop 0.3 kg)
|
kg/mmˆ2
|
1100
|
1050
|
|
|
Fracture
Toughness
(Chevron Notch)
|
MPa-mˆ1/2
|
2.9
|
3.1
|
|
|
Thermal
Expansion
(RT-1000° C)
|
10ˆ-6/°C
|
5.5
|
5.4
|
|
|
Thermal
Conductivity
@RT
|
(W/m-K)
|
125
|
160-180
|
|
|
Dielectric
Constant
|
1MHz
|
-
|
-
|
|
|
Loss
Tangent
|
|
-
|
-
|
|
|
ADVANCED CERAMICS sintered
Aluminum Nitride (AlN) is produced to be an isotropic near full density
material offering excellent thermal conductivity. Pressureless sintering
allows for near net shape forming of complex components for a wide variety of
electronic and structural applications.
The chart to the left lists typical properties.
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